FOV: 10μ: 40×30mm
Max PCB: 510(W)×680(D)mm
Weight: Approx. 850kg
Dimensions: 1180(W)×1640 (D)×1500(H) mm
Omron 3D AOI VT-S530
Specifications:
Omron VT-S530 is Industries Highest Value Full 3D-AOI System.
The VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero Escape and lowest False Rejects amongst other strengths.
VT-S530 series with Pre - Post Reflow configurations have been widely adopted in production lines where high value and quality control is required. VT-S530 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called "color highlight ™ 3D shape reconstruction technology", providing the highest accuracy in Solder Joint Inspection called ‘SJI’.
The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730-H with which it is sharing the new Image-Capture Module.
Features
Built Upon a History of Innovation and track record of High-Quality Solutions
High Speed Top View 12Mpix Camera with Telecentric Lens
Latest 3D Programmable DLP Projectors (25mm max Height Inspection)
Omron’s Unique Color-Highlight Illumination Technology
Single / Dual Lane and Pre / Post Reflow configurations
Real 3D Image Technology for Component and High-Quality Solder Joint Inspection
Real-time Interactive 3D data feedback to the Programmer
View and edit samples of all parts on the board simultaneously (in real-time)
Process histograms are created automatically for all inspection tests and components
AI self-optimization tools can perform automated inspection logic and criteria changes
Real defect images can be stored in the library and used to improve the tuning process
Consistent and quantitative inspection tests and logic across all component types
Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution
Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
Omron Q-upNavi: Combine SPI, AOI and AXI Inspection Result Data for True Root-Cause Process Analysis for Process Improvement.
Omron Q-upAuto: Advanced Manufacturing Analysis Combining Q-upNavi ‘Inspection Result Data’, with ‘Manufacturing Process Data’ for High Level Process Improvement.
VT-S530 is the latest 3D-AOI technology providing versatility for the Highest Value Quality Solutions, combining Highest Capability and Speed on the market, for tomorrows production environments.
Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
Weight | Approx. 850kg | |
Power supply | Voltage | 200 - 240VAC (single phase), voltage fluctuation range ±10% |
Normal rated power | 2.0kVA | |
Line height | 900±20mm | |
Air supply pressure | 0.3 - 0.6MPa | |
Operating temperature range | 10 - 35°C | |
Operating humidity range | 35 - 80%RH (Non-condensing) | |
Image signal input block | Imaging system | 12M pixel camera |
Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
Image resolution | 10μm/15μm | |
FOV | 10μ: 40×30mm | |
15μ: 60×45mm | ||
Functional specifications | Supported PCB size (min.) | 50(W)×50(D)mm |
Supported PCB size (max.) | Dual lane: 510(W)×330(D)mm | |
Single lane: 510(W)×680(D)mm | ||
Clearance | Above: 50mm; Below: 50mm | |
Height measurement range | 25mm | |
Thickness | 0.4 - 4mm | |
Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
Keywords:
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Contact: Tommy
Phone: +86 13691605420
E-mail: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China