Speed: 200,000 CPH
Applicable PCB:L50×W50mm - L700×W460mm
Weight:1700KG
Dimension:L1,254×W1,687×H1,445mm
Yamaha S20 Pick and Place Machine
Specifications:
Yamaha S20 Pick and Place Machine
Ultimate Flexibility to realize 3D MID* Placement
Enhancement to 3D MID
Large board handling capability
Wide ranging component handling capability and high feeder capacity
Ultimate flexibility and fast & easy setup
3D MID: Molded Interconnect Device
Model | S20 |
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L540 x W510mm |
Board thickness | 0.4 - 4.8mm |
Board flow direction | Left to right (Std) |
Board transfer speed | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (?+3?) | CHIP +/-0.040mm |
Placement accuracy B (?+3?) | IC +/-0.025mm |
Placement angle | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor |
Component height | Max 30mm*1 (Pre-placed components: max 25mm) |
Applicable components | 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 180 types (8mm tape), 45 lanes x 4 |
Transfer height | 900 +/- 20mm |
Machine dimensions, weight | L1750xD1750xH1420mm, Approx. 1,500kg |
*1 Board thickness + Component height = Max 30mm
Specifications and appearance are subject to change without prior notice.
Keywords:
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Contact: Tommy
Phone: +86 13691605420
E-mail: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China