solder content is between 360 to 410 kg
Maximum working width: up to 330 mm
Dimension: 2,000 mmx890x1,400 mm
Ersa ETS 330 Mini Wave Soldering Machine
Specifications:
Ersa ETS 330 Mini Wave Soldering Machine
A compact wave soldering system for the industrial manufacture of small to medium production volumes
Inline-capable dual wave soldering systems with 330 mm maximum working width and code operation
Precise and economic flux deposition on account of a freely defined spray area
Powerful preheat with 900 mm length protected by a glass ceramic (ceran glass) cover
Additional and programmable length of stay over the preheater for assemblies requiring more heat
Ideal combination of solder nozzles for all applications
Robust conveyor system with forced guidance of the pallet
Modern controls with a graphic user interface and touch-screen
Automatic heat-up with weekly time clock
Large solder program library with up to 199 different programs
Ersa ETS 330 -Mini Wave Soldering Machine
The Ersa ETS 330 is a microprocessor controlled Wave Soldering System to process boards populated with SMD and through-hole components up to a board width of 330 mm. The ETS 330 is ideal for the use with low-solid fluxes. The ability to store 199 programs, the clear text entry of all process relevant parameters and the self-monitoring function of the system ensure a high degree of repeatability.
Dimensions
Length approx. 2,000 mm
Width approx. 890 mm
Height approx. 1,400 mm
Conveyor systems
Pallet conveyor
Maximum conveyor speed: 2,5 m/min
Maximum working width: up to 330 mm
Media supply
Compressed air
Electrical power
Exhaust
Preheating
Heat transfer via medium and short wave radiation
Length of preheat: approx. 900 mm
Solder module
Depending on the alloy used, solder content is between 360 to 410 kg
Keywords:
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Contact: Tommy
Phone: +86 13691605420
E-mail: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China